Milestone for European 3D Integrated Superconducting Qubits, a Paper by Sandoko Kosen et al.
QST published a paper on 3D integrated qubits using a flip-chip architecture which was housed in LINQER, a sample holder from SCALINQ.
Tag: quantum processor packaging
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- IQM Achieves New 20-Qubit Benchmark Result with the LINQER80 Sample Holder
- Exciting News Coming To The APS March Meeting
- SCALINQ in the news: “Quantum computers could mean a revolution across all industries”
- Technical Sales Engineer
- SCALINQ Partners Up With Atlantic Quantum to Help Realize Large-scale Quantum Computing Through Cutting-Edge Hardware Components
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